Samsung and IBM have developed a revolutionary technology for the distribution of transistors on a chip
If Samsung Mobile and IBM engineers succeed in finalizing their technology, we can expect a huge increase in energy efficiency and the computing power of processors in the future. At a recent conference, companies demonstrated a revolutionary technology for distributing transistors on a chip.
The essence of the innovation is the placement of transistors perpendicularly and vertically on the silicon substrate, significantly increasing the current limits of processor performance and bringing new ideas to Moore's law.
If calculations are believed, the increased current could reduce power loss by about 85 percent compared to the FinFET layout of the transistors or increase processor performance by 100 percent. In particular, the new technology will make it possible to charge mobile devices no more than once a week.
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